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  d a t a sh eet product speci?cation supersedes data of 2000 feb 17 2003 mar 06 discrete semiconductors bzg01 series sma voltage regulator diodes b ook, halfpage m3d168
2003 mar 06 2 philips semiconductors product speci?cation sma voltage regulator diodes bzg01 series features glass passivated high maximum operating temperature ideal for surface mount automotive applications low leakage current excellent stability ul 94v-o classified plastic package zener working voltage range: 10 to 270 v for 35 types supplied in 12 mm embossed tape and reel, 1500 and 7500 pieces marking: cathode, date code, type name easy pick and place. description do-214ac surface mountable package with glass passivated chip. the well-defined void-free case is of a transfer-moulded thermo-setting plastic. the small rectangular package has two j bent leads. o lumns mbl143 top view side view cathode band ka fig.1 simplified outline (do-214ac) and symbol. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min. max. unit p tot total power dissipation t tp = 100 c; see fig.2 - 2.50 w t amb =25 c; see fig.2; device mounted on an al 2 o 3 printed-circuit board: see fig.5 - 1.50 w p zsm non-repetitive peak reverse power dissipation t p = 100 m s; square pulse; t j =25 c prior to surge; see fig.3 - 150 w t stg storage temperature - 65 +175 c t j junction temperature - 65 +175 c
2003 mar 06 3 philips semiconductors product speci?cation sma voltage regulator diodes bzg01 series electrical characteristics total series t j =25 c unless otherwise speci?ed. per type t j =25 c unless otherwise speci?ed. symbol parameter conditions max. unit v f forward voltage i f = 0.1 a; see fig.4 1.2 v type no. suffix (1) working voltage differential resistance temperature coefficient test current reverse current at reverse voltage v z (v) at i z r dif ( w )ati z s z (%/k) at i z i z (ma) i r ( m a) v r (v) min. nom. max. typ. max. min. max. max. c10 9.4 10 10.6 2 7 0.05 0.09 25 80 7.5 c11 10.4 11 11.6 3 8 0.05 0.10 20 40 8.2 c12 11.4 12 12.7 3 9 0.05 0.10 20 20 9.1 c13 12.4 13 14.1 3 10 0.05 0.10 20 10 10 c15 13.8 15 15.6 5 15 0.05 0.10 15 5 11 c16 15.3 16 17.1 5 15 0.06 0.11 15 2 12 c18 16.8 18 19.1 7 20 0.06 0.11 15 1 13 c20 18.8 20 21.2 8 24 0.06 0.11 10 1 15 c22 20.8 22 23.3 8 25 0.06 0.11 10 1 16 c24 22.8 24 25.6 8 25 0.06 0.11 10 1 18 c27 25.1 27 28.9 10 30 0.06 0.11 8 1 20 c30 28 30 32 10 30 0.06 0.11 8 1 22 c33 31 33 35 12 35 0.06 0.11 8 1 24 c36 34 36 38 13 40 0.06 0.11 8 1 27 c39 37 39 41 17 50 0.06 0.11 6 1 30 c43 40 43 46 17 50 0.07 0.12 6 1 33 c47 44 47 50 30 90 0.07 0.12 4 1 36 c51 48 51 54 40 115 0.07 0.12 4 1 39 c56 52 56 60 40 120 0.07 0.12 4 1 43 c62 58 62 66 40 125 0.08 0.13 4 1 47 c68 64 68 72 40 130 0.08 0.13 4 1 51 c75 70 75 79 40 135 0.08 0.13 4 1 56 c82 77 82 87 70 200 0.08 0.13 2.7 1 62 c91 85 91 96 80 250 0.09 0.13 2.7 1 68 c100 94 100 106 120 350 0.09 0.13 2.7 1 75 c110 104 110 116 150 450 0.09 0.13 2.7 1 82 c120 114 120 127 200 550 0.09 0.13 2 1 91 c130 124 130 141 250 700 0.09 0.13 2 1 100 c150 138 150 156 300 1000 0.09 0.13 2 1 110
2003 mar 06 4 philips semiconductors product speci?cation sma voltage regulator diodes bzg01 series note 1. to complete the type number the suffix is added to the basic type number, e.g. bzg01-c130. thermal characteristics notes 1. device mounted on an al 2 o 3 printed-circuit board, 0.7 mm thick; thickness of cu-layer 3 35 m m, see fig.5. 2. device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of cu-layer 3 40 m m, see fig.5. for more information please refer to the general part of associated handbook . c160 153 160 171 350 1100 0.09 0.13 1.5 1 120 c180 168 180 191 400 1200 0.09 0.13 1.5 1 130 c200 188 200 212 500 1500 0.09 0.13 1.5 1 150 c220 208 220 233 700 2250 0.09 0.13 1 1 160 c240 228 240 256 800 2550 0.09 0.13 1 1 180 c270 251 270 289 1000 3000 0.09 0.13 1 1 200 symbol parameter conditions value unit r th j-tp thermal resistance from junction to tie-point 30 k/w r th j-a thermal resistance from junction to ambient note 1 100 k/w note 2 150 k/w type no. suffix (1) working voltage differential resistance temperature coefficient test current reverse current at reverse voltage v z (v) at i z r dif ( w )ati z s z (%/k) at i z i z (ma) i r ( m a) v r (v) min. nom. max. typ. max. min. max. max.
2003 mar 06 5 philips semiconductors product speci?cation sma voltage regulator diodes bzg01 series graphical data handbook, halfpage 0 t ( c) p tot (w) 200 3 0 1 2 40 80 120 160 mcd826 solid line: tie-point temperature. dotted line: ambient temperature; device mounted on an al 2 o 3 printed-circuit board as shown in fig.5. fig.2 maximum total power dissipation as a function of temperature. handbook, halfpage 10 3 10 2 10 1 mcd825 10 - 2 10 - 1 1 t p (ms) p zsm (w) 10 t j =25 c prior to surge. fig.3 maximum non-repetitive peak reverse power dissipation as a function of pulse duration (square pulse). handbook, halfpage 1 v f (v) i f (a) 1.5 3 0 1 2 1.1 1.2 1.3 1.4 mcd824 t j =25 c. fig.4 forward current as a function of forward voltage; typical values. msb213 4.5 2.5 1.25 50 50 dimensions in mm. fig.5 printed-circuit board for surface mounting.
2003 mar 06 6 philips semiconductors product speci?cation sma voltage regulator diodes bzg01 series package outline references outline version european projection issue date iec jedec eiaj sod124 99-10-22 do-214ac 0 2.5 5 mm scale transfer-moulded thermo-setting plastic small rectangular surface mounted package; 2 connectors sod124 unit b a 1 cd e q mm 1.6 1.4 0.2 0.05 2.8 2.4 4.5 4.3 h 5.5 5.1 3.3 2.7 dimensions (mm are the original dimensions) a 2.3 2.0 d h a e b (1) a 1 q c note 1. the marking band indicates the cathode.
2003 mar 06 7 philips semiconductors product speci?cation sma voltage regulator diodes bzg01 series data sheet status notes 1. please consult the most recently issued data sheet before initiating or completing a design. 2. the product status of the device(s) described in this data sheet may have changed since this data sheet was published. the latest information is available on the internet at url http://www.semiconductors.philips.com. 3. for data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. level data sheet status (1) product status (2)(3) definition i objective data development this data sheet contains data from the objective speci?cation for product development. philips semiconductors reserves the right to change the speci?cation in any manner without notice. ii preliminary data quali?cation this data sheet contains data from the preliminary speci?cation. supplementary data will be published at a later date. philips semiconductors reserves the right to change the speci?cation without notice, in order to improve the design and supply the best possible product. iii product data production this data sheet contains data from the product speci?cation. philips semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. relevant changes will be communicated via a customer product/process change noti?cation (cpcn). definitions short-form specification ? the data in a short-form specification is extracted from a full data sheet with the same type number and title. for detailed information see the relevant data sheet or data handbook. limiting values definition ? limiting values given are in accordance with the absolute maximum rating system (iec 60134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the specification is not implied. exposure to limiting values for extended periods may affect device reliability. application information ? applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. disclaimers life support applications ? these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips semiconductors for any damages resulting from such application. right to make changes ? philips semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. when the product is in full production (status production), relevant changes will be communicated via a customer product/process change notification (cpcn). philips semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
? koninklijke philips electronics n.v. 2003 sca75 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not con vey nor imply any license under patent- or other industrial or intellectual property rights. philips semiconductors C a worldwide company contact information for additional information please visit http://www.semiconductors.philips.com . fax: +31 40 27 24825 for sales of?ces addresses send e-mail to: sales.addresses@www.semiconductors.philips.com . printed in the netherlands 613510/02/pp 8 date of release: 2003 mar 06 document order number: 9397 750 10974


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